- Manufacture :
- Series :
- Operating Temperature :
- Plating - Thickness :
- Attachment Method :
8 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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2,545
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Laird Technologies EMI | NOSG,STR,SNB,USFT,PSA | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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1,542
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Laird Technologies EMI | CLO,STRSNB,USFT | Clip-On | Active | Beryllium Copper | 121°C | Fingerstock | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.440" (11.18mm) | Tin | 299.21µin (7.60µm) | Clip | |||
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1,422
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Laird Technologies EMI | NOSG,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.080" (2.03mm) | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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1,964
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Laird Technologies EMI | NOSG,STR,SNB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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3,503
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Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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715
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Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | 0.080" (2.03mm) | 25.000 (7.62m) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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2,797
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Leader Tech Inc. | 0.08 X 0.25 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | Flash | Adhesive | |||
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3,581
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Leader Tech Inc. | 0.08 X 0.45 SN 16--8-45LPAH-SN-1 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Tin | Flash | Adhesive |