- Manufacture :
- Operating Temperature :
- Plating :
- Plating - Thickness :
11 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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3,715
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Laird Technologies EMI | NOSG,STR,SNB,USFT,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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1,992
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Leader Tech Inc. | 0.23 X 0.76 NI 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Nickel | Flash | Adhesive | |||
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2,584
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Laird Technologies EMI | NOSG COIL BF USF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Unplated | - | Adhesive | |||
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3,191
Ships today + free overnight shipping
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Laird Technologies EMI | NOSG,STR,BF,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | 299.21µin (7.60µm) | Adhesive | |||
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2,807
Ships today + free overnight shipping
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Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | - | Adhesive | |||
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3,579
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Laird Technologies EMI | GASKET BECU 19.3X609.6MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | - | - | Adhesive | |||
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3,333
Ships today + free overnight shipping
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Leader Tech Inc. | 0.23 X 0.76 SN 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | Flash | Adhesive | |||
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922
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Leader Tech Inc. | 0.23 X 0.76 BD 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Unplated | - | Adhesive | |||
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3,709
Ships today + free overnight shipping
|
Leader Tech Inc. | 0.23 X 0.76 BD 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Unplated | - | Adhesive | |||
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962
Ships today + free overnight shipping
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Laird Technologies EMI | NOSG,STR,NIB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
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2,854
Ships today + free overnight shipping
|
Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.760" (19.30mm) | Tin | 299.21µin (7.60µm) | Adhesive |