OKAYCHIP
BOM
5 products
IMAGE PART NO. PRICE QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Material Operating Temperature Type Shape Height Length Width Plating Attachment Method
0C98055902
Per Unit
$121.7625
RFQ
3,260
Ships today + free overnight shipping
Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock - 0.070" (1.78mm) 24.000" (609.60mm) 0.300" (7.62mm) Unplated Adhesive
0C97055502
Per Unit
$121.5488
RFQ
3,286
Ships today + free overnight shipping
Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock - 0.070" (1.78mm) 24.000" (609.60mm) 0.340" (8.64mm) Unplated Adhesive
0C97055902
Per Unit
$121.5488
RFQ
3,592
Ships today + free overnight shipping
Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock - 0.070" (1.78mm) 24.000" (609.60mm) 0.300" (7.62mm) Unplated Adhesive
0C97055002
Per Unit
$103.5600
RFQ
3,781
Ships today + free overnight shipping
Laird Technologies EMI RFI EMI GROUNDING MATERIAL 25FT Twist Active Beryllium Copper 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Unplated Adhesive
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Per Unit
$4.8518
RFQ
3,622
Ships today + free overnight shipping
Laird Technologies EMI TWT COIL BF USF PSA Twist Active Beryllium Copper 121°C Fingerstock - 0.030" (0.76mm) 24.000" (609.60mm) 0.230" (5.84mm) Unplated Adhesive
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