- Manufacture :
- Series :
- Operating Temperature :
- Height :
- Plating - Thickness :
- Attachment Method :
4 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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3,036
Ships today + free overnight shipping
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Laird Technologies EMI | AP,STR,SNB,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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2,924
Ships today + free overnight shipping
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Laird Technologies EMI | AP,STR,SNSAT,RA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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2,576
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Leader Tech Inc. | 0.10 X 0.26 SN 16--10-26UD-SN-16 | TechMESH | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.260" (6.60mm) | Tin | Flash | Adhesive | |||
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2,607
Ships today + free overnight shipping
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Laird Technologies EMI | FLX,STR,SNB | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.260" (6.60mm) | Tin | 299.21µin (7.60µm) | Snap-In |