- Manufacture :
- Operating Temperature :
- Height :
- Plating - Thickness :
21 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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3,184
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Leader Tech Inc. | 0.07 X .25 X 045 SNPB 24--7-21C- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.250" (6.35mm) | Lead, Tin | Flash | Adhesive | |||
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2,321
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Laird Technologies EMI | NOSG COIL BF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | |||
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716
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Laird Technologies EMI | NOSG,STR,BF,USFT | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | |||
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1,811
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Leader Tech Inc. | 0.07 X .25 X 045 CDC 16--7-21C-0 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.070" (1.78mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Cadmium + Clear Chromate | Flash | Adhesive | |||
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2,883
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Laird Technologies EMI | FINGERSTCK ULTRASFT 6.35X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | |||
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1,964
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Laird Technologies EMI | NOSG,STR,SNB,USF,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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1,078
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Leader Tech Inc. | 0.08 X 0.25 BD 400--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 33.33 (10.16m) | 0.250" (6.35mm) | Unplated | - | Adhesive | |||
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2,619
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Laird Technologies EMI | NOSG,STR,NIB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
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3,503
Ships today + free overnight shipping
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Laird Technologies EMI | NOSG,STR,SNB,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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851
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Laird Technologies EMI | NOSG,STR,ZNC,PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | |||
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715
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Laird Technologies EMI | NOSG COIL SNB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 25.000 (7.62m) | 0.250" (6.35mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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3,090
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Laird Technologies EMI | NOSG COIL NIB PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21µin (7.60µm) | Adhesive | |||
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1,688
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Laird Technologies EMI | NOSG COIL ZNY PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | |||
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3,642
Ships today + free overnight shipping
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Laird Technologies EMI | NOSG COIL BF USF PSA | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | |||
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3,616
Ships today + free overnight shipping
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Laird Technologies EMI | NOSG,STR,BF | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | |||
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3,976
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Leader Tech Inc. | COPPER BERYLLIUM FINGERSTOCK EMI | - | Active | Beryllium Copper | - | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | |||
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2,495
Ships today + free overnight shipping
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Leader Tech Inc. | 0.07 X .25 X 045 NI 16--7-21C-04 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.070" (1.78mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | Flash | Adhesive | |||
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2,894
Ships today + free overnight shipping
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Leader Tech Inc. | 0.07 X .25 X 045 SN 16--7-21C-04 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.070" (1.78mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | Flash | Adhesive | |||
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2,797
Ships today + free overnight shipping
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Leader Tech Inc. | 0.08 X 0.25 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | Flash | Adhesive | |||
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2,019
Ships today + free overnight shipping
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Leader Tech Inc. | 0.07 X .25 X 045 BD 16--7-21C-04 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.070" (1.78mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | |||
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2,823
Ships today + free overnight shipping
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Laird Technologies EMI | GASKET BECU ALLOY 6.35X406.4MM | Foldover | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive |