- Manufacture :
- Operating Temperature :
- Height :
- Plating - Thickness :
7 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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3,420
Ships today + free overnight shipping
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Leader Tech Inc. | 0.11 X 0.28 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | |||
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3,517
Ships today + free overnight shipping
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Leader Tech Inc. | 0.11 X 0.28 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | |||
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2,921
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Leader Tech Inc. | 0.11 X 0.28 X 0.24 SN 16.0--FOLD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | |||
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3,993
Ships today + free overnight shipping
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Leader Tech Inc. | 0.11 X 0.28 X 0.23 SN 16--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | |||
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3,857
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Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.055" (1.40mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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2,850
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive | |||
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1,566
Ships today + free overnight shipping
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Laird Technologies EMI | GASKET BECU 7.11X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive |