- Part Status :
- Operating Temperature :
- Voltage - Supply (Vcc/Vdd) :
- Program Memory Type :
- Data Converters :
- Oscillator Type :
84 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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851
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NXP USA Inc. | ULTRA RELIABLE MCU WITH VAST PER | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-LFBGA | 324-MAPBGA (19x19) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 246 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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965
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NXP USA Inc. | ULTRA RELIABLE MCU WITH VAST PER | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,347
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NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,534
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,666
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NXP USA Inc. | ULTRA RELIABLE MCU WITH VAST PER | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,511
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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686
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NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,134
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NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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775
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NXP USA Inc. | 32 BIT6MB FLASH768 RAM | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,514
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NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,287
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NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,182
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NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,188
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NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2MB (2M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,655
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NXP USA Inc. | 2.5MB NVM 2 X E200Z4 CORES 180 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,304
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NXP USA Inc. | 1.5MB NVM 2 X E200Z4 CORES 200 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1.5MB (1.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,547
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NXP USA Inc. | 1MB NVM 2 X E200Z4 CORES 180MH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 135°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 128K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1MB (1M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,467
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NXP USA Inc. | 1.5MB NVM 2 X E200Z4 CORES 200 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1.5MB (1.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,935
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Cypress Semiconductor Corp | IC MCU 16BIT 128KB MROM 64LQFP | F²MC-16LX MB90350E | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (12x12) | DMA, LVD, POR, WDT | F²MC-16LX | 24MHz | 3.5 V ~ 5.5 V | 51 | 4K x 8 | 16-Bit | CAN, EBI/EMI, I²C, LIN, UART/USART | 128KB (128K x 8) | Mask ROM | - | A/D 15x8/10b | Internal | |||
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2,277
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Cypress Semiconductor Corp | IC MCU 16BIT 128KB MROM 64LQFP | F²MC-16LX MB90350 | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (12x12) | DMA, LVD, POR, WDT | F²MC-16LX | 24MHz | 3.5 V ~ 5.5 V | 51 | 4K x 8 | 16-Bit | CAN, EBI/EMI, I²C, LIN, UART/USART | 128KB (128K x 8) | Mask ROM | - | A/D 15x8/10b | Internal | |||
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3,431
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Cypress Semiconductor Corp | IC MCU 16BIT 64KB MROM 64LQFP | F²MC-16LX MB90350 | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (12x12) | DMA, LVD, POR, WDT | F²MC-16LX | 24MHz | 3.5 V ~ 5.5 V | 51 | 4K x 8 | 16-Bit | CAN, EBI/EMI, I²C, LIN, UART/USART | 64KB (64K x 8) | Mask ROM | - | A/D 15x8/10b | Internal | |||
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3,637
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Cypress Semiconductor Corp | IC MCU 16BIT 64KB MROM 64LQFP | F²MC-16LX MB90350 | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (12x12) | DMA, LVD, POR, WDT | F²MC-16LX | 24MHz | 3.5 V ~ 5.5 V | 51 | 4K x 8 | 16-Bit | CAN, EBI/EMI, I²C, LIN, UART/USART | 64KB (64K x 8) | Mask ROM | - | A/D 15x8/10b | Internal | |||
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1,677
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Cypress Semiconductor Corp | IC MCU 16BIT 64KB MROM 64LQFP | F²MC-16LX MB90350 | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP | 64-LQFP (12x12) | DMA, LVD, POR, WDT | F²MC-16LX | 24MHz | 3.5 V ~ 5.5 V | 51 | 4K x 8 | 16-Bit | CAN, EBI/EMI, I²C, LIN, UART/USART | 64KB (64K x 8) | Mask ROM | - | A/D 15x8/10b | Internal | |||
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3,161
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Cypress Semiconductor Corp | IC MCU 16BIT 64KB FLASH 64LQFP | F²MC-16LX MB90350 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (12x12) | DMA, LVD, POR, WDT | F²MC-16LX | 24MHz | 3.5 V ~ 5.5 V | 51 | 4K x 8 | 16-Bit | CAN, EBI/EMI, I²C, LIN, UART/USART | 64KB (64K x 8) | Flash | - | A/D 15x8/10b | Internal | |||
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3,972
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Cypress Semiconductor Corp | IC MCU 16BIT 64KB FLASH 64LQFP | F²MC-16LX MB90350 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (12x12) | DMA, LVD, POR, WDT | F²MC-16LX | 24MHz | 3.5 V ~ 5.5 V | 51 | 4K x 8 | 16-Bit | CAN, EBI/EMI, I²C, LIN, UART/USART | 64KB (64K x 8) | Flash | - | A/D 15x8/10b | Internal | |||
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1,013
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Cypress Semiconductor Corp | IC MCU 16BIT 64KB FLASH 64LQFP | F²MC-16LX MB90350 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (12x12) | DMA, LVD, POR, WDT | F²MC-16LX | 24MHz | 3.5 V ~ 5.5 V | 51 | 4K x 8 | 16-Bit | CAN, EBI/EMI, I²C, LIN, UART/USART | 64KB (64K x 8) | Flash | - | A/D 15x8/10b | Internal | |||
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1,011
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NXP USA Inc. | DUAL CORE 6M FLASH 768K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,178
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,710
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NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 512 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,613
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NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 512K R | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,665
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal |
