- Packaging :
- Operating Temperature :
- Core Processor :
- Voltage - Supply (Vcc/Vdd) :
- Core Size :
- Data Converters :
- Oscillator Type :
70 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,040
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | |||
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1,535
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 516FBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,208
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | |||
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673
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | |||
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3,618
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | |||
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3,873
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | |||
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1,497
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 516BGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | |||
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2,562
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | |||
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2,536
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 416BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,642
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,893
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 64x12b | External | |||
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3,195
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 64K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | External | |||
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2,673
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 112MHz | 1.35 V ~ 1.65 V | 256 | 64K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | External | |||
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2,404
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NXP USA Inc. | IC MCU 16BIT 512KB FLASH 144LQFP | 56F8xxx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | POR, PWM, Temp Sensor, WDT | 56800E | 60MHz | 2.25 V ~ 3.6 V | 62 | 18K x 16 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 512KB (256K x 16) | Flash | - | A/D 16x12b | External | |||
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1,624
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NXP USA Inc. | IC MCU 16BIT 128KB FLASH 52LQFP | HCS12 | Active | Tray | -40°C ~ 125°C (TA) | 52-LQFP | 52-TQFP (10x10) | POR, PWM, WDT | HCS12 | 25MHz | 2.35 V ~ 5.5 V | 35 | 4K x 8 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 128KB (128K x 8) | Flash | - | A/D 8x10b | Internal | |||
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3,819
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NXP USA Inc. | IC MCU 16BIT 128KB FLASH 80QFP | HCS12 | Active | Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | POR, PWM, WDT | HCS12 | 25MHz | 2.35 V ~ 5.5 V | 60 | 4K x 8 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 128KB (128K x 8) | Flash | - | A/D 8x10b | Internal | |||
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1,875
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NXP USA Inc. | IC MCU 16BIT 128KB FLASH 80QFP | HCS12 | Active | Tray | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | POR, PWM, WDT | HCS12 | 25MHz | 2.35 V ~ 5.5 V | 60 | 4K x 8 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 128KB (128K x 8) | Flash | - | A/D 8x10b | Internal | |||
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759
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NXP USA Inc. | IC MCU 16BIT 32KB FLASH 48LQFP | HCS12 | Active | Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR, PWM, WDT | HCS12 | 16MHz | 2.35 V ~ 5.5 V | 31 | 2K x 8 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 32KB (32K x 8) | Flash | - | A/D 8x10b | Internal | |||
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2,404
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NXP USA Inc. | IC MCU 16BIT 32KB FLASH 48LQFP | HCS12 | Active | Tray | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR, PWM, WDT | HCS12 | 25MHz | 2.35 V ~ 5.5 V | 31 | 2K x 8 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 32KB (32K x 8) | Flash | - | A/D 8x10b | Internal | |||
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1,303
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NXP USA Inc. | IC MCU 16BIT 120KB FLASH 160BGA | 56F8xx | Active | Tray | -40°C ~ 85°C (TA) | 160-BGA | 160-MAPBGA (15x15) | POR, PWM, WDT | 56800 | 80MHz | 3 V ~ 3.6 V | 32 | 4K x 16 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 120KB (60K x 16) | Flash | - | A/D 16x12b | External | |||
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2,360
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NXP USA Inc. | IC MCU 16BIT 64KB FLASH 128LQFP | 56F8xxx | Active | Tray | -40°C ~ 125°C (TA) | 128-LQFP | 128-LQFP (14x20) | POR, PWM, Temp Sensor, WDT | 56800E | 60MHz | 2.25 V ~ 3.6 V | 49 | 6K x 16 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 64KB (32K x 16) | Flash | - | A/D 16x12b | External | |||
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1,434
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NXP USA Inc. | IC MCU 16BIT 32KB FLASH 80QFP | HCS12 | Active | Tray | -40°C ~ 125°C (TA) | 80-QFP | 80-QFP (14x14) | POR, PWM, WDT | HCS12 | 16MHz | 2.35 V ~ 5.5 V | 60 | 2K x 8 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 32KB (32K x 8) | Flash | - | A/D 8x10b | Internal | |||
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2,768
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NXP USA Inc. | IC MCU 16BIT 64KB FLASH 80QFP | HCS12 | Active | Tray | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | POR, PWM, WDT | HCS12 | 25MHz | 2.35 V ~ 5.5 V | 60 | 4K x 8 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 64KB (64K x 8) | Flash | - | A/D 8x10b | Internal | |||
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1,312
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NXP USA Inc. | IC MCU 16BIT 64KB FLASH 52LQFP | HCS12 | Active | Tray | -40°C ~ 125°C (TA) | 52-LQFP | 52-TQFP (10x10) | POR, PWM, WDT | HCS12 | 25MHz | 2.35 V ~ 5.5 V | 35 | 4K x 8 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 64KB (64K x 8) | Flash | - | A/D 8x10b | Internal | |||
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1,317
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NXP USA Inc. | IC MCU 16BIT 96KB FLASH 48LQFP | HCS12 | Active | Tray | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR, PWM, WDT | HCS12 | 25MHz | 2.35 V ~ 5.5 V | 31 | 4K x 8 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 96KB (96K x 8) | Flash | - | A/D 8x10b | Internal | |||
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3,051
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NXP USA Inc. | IC MCU 16BIT 128KB FLASH 144LQFP | 56F8xxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | POR, PWM, Temp Sensor, WDT | 56800E | 60MHz | 2.25 V ~ 3.6 V | 62 | 6K x 16 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 128KB (64K x 16) | Flash | - | A/D 16x12b | External | |||
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3,000
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NXP USA Inc. | IC MCU 16BIT 64KB FLASH 48LQFP | HCS12 | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 48-LQFP | 48-LQFP (7x7) | POR, PWM, WDT | HCS12 | 25MHz | 2.35 V ~ 5.5 V | 31 | 4K x 8 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 64KB (64K x 8) | Flash | - | A/D 8x10b | Internal | |||
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1,318
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NXP USA Inc. | IC MCU 16BIT 256KB FLASH 160LQFP | 56F8xxx | Active | Tray | -40°C ~ 125°C (TA) | 160-LQFP | 160-LQFP (24x24) | POR, PWM, Temp Sensor, WDT | 56800E | 60MHz | 2.25 V ~ 3.6 V | 76 | 10K x 16 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 256KB (128K x 16) | Flash | - | A/D 16x12b | External | |||
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3,811
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NXP USA Inc. | IC MCU 16BIT 96KB FLASH 80QFP | HCS12 | Active | Tray | -40°C ~ 85°C (TA) | 80-QFP | 80-QFP (14x14) | POR, PWM, WDT | HCS12 | 25MHz | 2.35 V ~ 5.5 V | 60 | 4K x 8 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 96KB (96K x 8) | Flash | - | A/D 8x10b | Internal | |||
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3,882
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NXP USA Inc. | IC MCU 16BIT 128KB FLASH 52LQFP | HCS12 | Active | Tray | -40°C ~ 85°C (TA) | 52-LQFP | 52-TQFP (10x10) | POR, PWM, WDT | HCS12 | 25MHz | 2.35 V ~ 5.5 V | 35 | 4K x 8 | 16-Bit | CAN, EBI/EMI, SCI, SPI | 128KB (128K x 8) | Flash | - | A/D 8x10b | Internal |
