3705 PARTS: SHIPS TODAY
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- Manufacturer :
- Laird Technologies - Thermal Materials
- Product Category :
- Thermal - Pads, Sheets
- Adhesive :
- -
- Backing, Carrier :
- -
- Color :
- Amber
- Material :
- Polyimide, Ceramic Filled
- Outline :
- 457.20mm x 279.40mm
- Part Status :
- Active
- Series :
- Tgard™ K52
- Shape :
- Rectangle
- Thermal Conductivity :
- -
- Thermal Resistivity :
- -
- Thickness :
- 0.0020" (0.051mm)
- Type :
- Insulator Pad, Sheet
- Usage :
- -
- Datasheet :
- A14692-30
Cross References
PEOPLE WHO BOUGHT Thermal - Pads, Sheets ALSO BOUGHT
PEOPLE VIEWING A14692-30 THEN BOUGHT
Lastest News
05/11/2022
05/11/2022
05/11/2022
05/11/2022
Search Part Number: "A146" Included word is 15
| Part Number | Manufacturer | Stock | Description |
|---|---|---|---|
| A1468LK-T | Allegro MicroSystems, LLC | 916 | MAGNETIC SWITCH SPEC PURP 4SIP |
| A1469LK-T | Allegro MicroSystems, LLC | 1,766 | MAGNETIC SWITCH SPEC PURP 4SIP |
| A1468LK-W-T | Allegro MicroSystems, LLC | 2,265 | MAGNETIC SWITCH SPEC PURP 4SIP |
| A1460A-1PQ160C | Microsemi Corporation | 2,782 | IC FPGA 131 I/O 160QFP |
| A1460A-PQG208I | Microsemi Corporation | 2,118 | IC FPGA 167 I/O 208QFP |
| A1460A-1PQG160C | Microsemi Corporation | 3,442 | IC FPGA 131 I/O 160QFP |
| A1460A-PQG208C | Microsemi Corporation | 1,641 | IC FPGA 167 I/O 208QFP |
| A1460A-PG207C | Microsemi Corporation | 1,876 | IC FPGA 168 I/O 207CPGA |
| A1460A-1PG207M | Microsemi Corporation | 2,522 | IC FPGA 168 I/O 207CPGA |
| A1460A-1PG207C | Microsemi Corporation | 1,287 | IC FPGA 168 I/O 207CPGA |
| A1460A-1PG207B | Microsemi Corporation | 2,432 | IC FPGA 168 I/O 207CPGA |
| A1460A-PG207B | Microsemi Corporation | 917 | IC FPGA 168 I/O 207CPGA |
| A1460A-PG207M | Microsemi Corporation | 2,522 | IC FPGA 168 I/O 207CPGA |
| A1460A-1CQ196C | Microsemi Corporation | 3,446 | IC FPGA 168 I/O 196CQFP |
| A1460A-CQ196C | Microsemi Corporation | 740 | IC FPGA 168 I/O 196CQFP |
